* Ultra low VF per footprint area
* Low leakage
* Low thermal resistance
* One-fifth footprint of SMA
* Super low profile (0.6 mm)
* Available tes.

* Reverse polarity protection FlipKY®
* Current steering
* Freewheeling
* Flyback
* Oring DESCRIPT.

Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The four bump 1.5 x 1.5 mm devices can deliver up to 1.5 A and occupy only 2.3 mm2 of board spa.

FCSP230LTR

FCSP240LTR

FCSP0530ETR

FCSP0530TR

FCSP05H40ETR

FCSP05H40TR

FCSP0730TR

FCSP07H40TR

FCSP130ETR

FCSP130LTR

FCSP130TR

FCSP140ETR

FCSP140LTR